12 March 2020

What is MIL-STD-810-G ?

In the industrial and business market there is often a need for a robust device. Consumer products are simply not designed for these applications. We often talk about smartphones, PDA, terminals and tablets with this certification. Eutronix only supplies products for this specific market that meet this certification.

Why is this necessary? Is a sturdy rubber case not enough? The answer is no. The MIL-STD-810G testing involves much more than just surviving a fall to the ground.

The MIL-STD-810 standard is designed to inspire confidence in the environmental value and durability of the material’s designs and offers a comprehensive range of test methods:

  • Drop test
  • Vibrations
  • Wind and rain
  • Sand and dust
  • extreme temperatures
  • Salty fog
  • Humidity
  • High altitude

The MIL-STD-810 includes a series of performance and manufacturing guidelines issued by the United States Department of Military and Commercial Equipment. This first test method was drawn up in 1945, after which the first MIL-STD-810 edition was released in 1962.

These guidelines indicate which parts are permitted and the environmental conditions in which an device must be able to continue to function. This method is the highest standard for testing rugged mobile devices.

The tests are divided into 24 categories and associated procedures. Depending on the application, the tests are carried out in a laboratory or in the field. Procedures are regularly reviewed to maintain compliance with current guidelines. This makes the latest standard the MIL-STD-810H. Most current rugged devices have been tested to MIL-STD-810G guidelines.

In addition to this MIL-STD-810, the following matters are also important in following this standard:

  • Using Pogo Pin connectors instead of USB connectors reduces the risk of damage.
  • The use of robust accessories increases continuity and durable use.

 

A selection of the tough MIL-STD-810G test procedures that rugged devices must pass:
Method 501.5 – High Temperatures A test procedure in which the performance of a robust device is tested by exposing the device to very high temperatures.
Method 502.5 – Low Temperatures A tough test procedure where the performance of device is tested when the device is exposed to low temperatures.
Method 503.5 – Temperature Shock The temperature shock test determines whether a device can withstand the sudden change in temperature in the surrounding atmosphere without loss of performance or damage ot the device. The test is intended to assess whether a device can still be operated safely when extreme temperature changes take place.
Method 506.5 – Rain test The rain resistance of a robust device is tested in “wind-driven” rain.
Method 516.6 – Drop Test (Shock) To qualify for MIL-STD 810G, 26 different types of drop tests are carried out with a maximum of 5 devices.

Drop test: Drop from 1.2m high on hard surface.

Tumble proof: Dropping the devices from different angles.

Not every MIL-STD-810 device is equally robust, as it is a flexible standard. The manufacturer can adapt the test methods and has a large margin to play within these guidelines. The devices offered at Eutronix have been specifically developed and tested in accordance with the MIL-STD-810 guidelines, which means that these devices can operate extremely well in extreme weather conditions, in applications where shock resistance plays a role and also have a drop test with corresponding IP rating. .

Within the Eutronix product portfolio, we look at the application and the environment in which the device is used. For example, it differs per application which device is most suitable, but it always has the MIL-STD-810 certification.

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